Industries, 02
Semiconductor
From wafer fab to final test, one stack. Smarter inspection, connected legacy equipment, and a floor that runs itself.
Full Stack
No Blind Spots.
In semiconductor, an unchecked defect does not stay small. It compounds at every step until it kills yield.
We work the full stack. Yield recovered from dies being incorrectly rejected. Legacy equipment connected to the modern fab. Vision systems built from scratch for what standard tools cannot see.
Everything smarter.
How It Works
DETECT
In 2D and 3D
2D surface plus height. Defects other tools miss.
RECOVER
Yield Recovered
False rejects reclassified. Good dies back in count.
CONNECT
Legacy, Connected
Equipment that was dark is now on the network.
MONITOR
Excursions Stopped
Drift caught before it becomes a scrap event.
Key Capabilities
The full stack, made smarter, wafer fab to final test.
Yield Recovery from False Rejects
Reclassifies false rejects on your existing tool. Good dies back. No recipe change, no swap.
3D AOI with Height Detection
Our own AOI measures height, not just surface. Lifted bonds, overlapping wires, coplanarity issues caught.
Lights-Out Legacy Operation
Jams cleared, recipes managed, older tools running unattended. No technician needed.
Host Connectivity Enablement
Dark equipment gets host connectivity, isolated tools linked to modern MES and EDA systems.
Vision Built for Your Tolerance
Designed for your geometry, your lighting, your tolerance. Bare die to advanced packaging.
Line-Wide Yield Intelligence
Process health across every stage. Drift flagged. Excursions stopped before yield is hit.
Autonomous Floor.
Legacy tools running lights-out. Dark equipment on the network. Yield recovered. We connect, automate, and upgrade your floor.
Always On. Unattended.
Ready to Upgrade Your Fab?
New tool or legacy floor, we connect, automate, and recover yield.